Principal Optical System Architect; Remote

Position: Principal Optical System Architect (Remote) Principal Optical System Architect (Remote) At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Data communications applications change at an exponential pace and TE Connectivity’s Digital Data Networks Business Unit (DDN BU) is at the heart of a continuously expanding connected life. We provide responsive, iterative, and fundamentally agile capabilities to support today's demands. Our customers are building the devices and the infrastructure that is redefining what information technology means. Our products drive market innovation and meet the ever-changing needs of an increasingly connected, data-driven world. We are enhancing the way we do business, focusing on the most important things and staying agile and responsive to the needs of a faster, more connected world. As the R&D Product Development Engineer – Optical System Architect (SA), you will drive the next generation of Technology innovations in the Optical connectivity area. You will be focused on pluggable optical transceivers, near/co-package optical transceivers, optical interconnects for advanced AI/HPC environment, compute, storage, and networking hardware markets. You will apply your technical expertise and industry knowledge to influence the BU strategy and contribute to key product/technology decisions. You will collaborate closely with the Business Development and Strategy teams on M&A scenarios and projects, performing technical evaluations and assessing how the technology will intersect with future product/technology trends and the needs of our customers and industry. This role reports to the Director, leading the broader SA organization. Key Responsibilities Technical Leadership & Customer Engagement • Serve as the primary technical liaison for TE’s customers, actively engaging with hyperscalers, OEMs, and system architects to gain deep insights into next-gen compute, AI, storage, and networking challenges. • Proactively identify and assess technology disruptors, translating emerging trends into strategic R&D initiatives and product development roadmaps to maintain TE’s industry leadership. • Cultivate and strengthen customer partnerships, fostering co-development opportunities and collaborative innovation to accelerate next-gen infrastructure advancements. • Drive thought leadership by educating and influencing internal and external stakeholders, from executives and product teams to key decision-makers in customer organizations, on emerging industry trends, TE’s technical capabilities, and high-value engineering solutions. • Bridge the gap between customer needs and TE’s technology roadmap, ensuring TE delivers future-proof, scalable, and high-performance interconnect solutions tailored to the evolving datacenter landscape. System-Level Architecture & Product Strategy • Define high-level system architecture requirements, ensuring TE’s product roadmap is aligned with next-generation compute, AI, and networking ecosystems. • Drive TE’s technology vision and strategy, ensuring our interconnect solutions support the evolving needs of standards like OSFP, QSFP-DD, COBO, and standards set by OIF and IEEE, particularly as they relate to AI/ML workloads and next-generation data center architectures. • Lead the evaluation of high-speed electrical, optical, and hybrid interconnect solutions, balancing performance, power, latency, cost, and manufacturability. • Collaborate with internal R&D, product development, and business units to shape product development roadmaps based on real-world customer challenges and market trends. • Drive technical due diligence for potential partnerships, acquisitions, and ecosystem collaborations, ensuring TE stays at the forefront of innovation. Co-Packaged and Near-Package Optics Architecture Leadership • Drive the design and system architecture of co-packaged optics (CPO) or near-packaged (NPO) solutions, integrating optical interconnects tightly with high-radix ASIC subsystems to enable ultra-high bandwidth and low-latency data transmission. • Define novel, scalable CPO/NPO architectures to meet future performance, power, and density… Apply tot his job