**Experienced Full Stack Semiconductor Bundling Designing Lead – Web & Cloud Application Development**

At arenaflex, we're pushing the boundaries of innovation, empowering groundbreaking new products and services that transform the world. If you're passionate about details and driven by a desire for excellence, imagine what you could achieve here! We're a dynamic team of visionaries, and we're seeking a diligent and energetic IC Bundling Designing Lead to join our ranks. **Introduction to arenaflex** arenaflex is a world-renowned leader in the tech industry, known for our commitment to innovation and excellence. We're a company that thrives on creativity, collaboration, and a passion for pushing the boundaries of what's possible. Our team of experts is dedicated to developing cutting-edge products and services that transform the world, and we're looking for talented individuals like you to join our journey. **Key Responsibilities** As an IC Bundling Designing Lead at arenaflex, you'll have the opportunity to work on some of the most exciting and challenging projects in the industry. Your key responsibilities will include: * Collaborating with cross-functional teams to lead bundle integration and design efforts * Working with external and OSAT partners to bring bundling solutions from concept to HVM drive industry with cutting-edge buddle arrangements and specs ~10% Global travel * Developing innovative bundling solutions from concept to large-scale manufacturing, including bundle, module, and innovation advancement * Leading and managing teams to achieve project goals and objectives * Working independently and taking on projects with minimal oversight * Developing and implementing process improvements to increase efficiency and productivity **Key Capabilities** To succeed in this role, you'll need to possess a unique combination of skills and experience. Here are some of the key capabilities we're looking for: * Experience in Semiconductor Bundling Configuration, Cycle and Innovation Advancement * Strong understanding of cross-functional bundling areas: Si floor plan, bundle format and engineering, empowering process advancements, warm, mechanical, SI/PI, material, part and system level reliability, testing, and FA * Proficiency in cutting-edge bundling technologies: Information and knowledge to convey high density/elite performance interconnects in different structure factor, thermo-mechanical, reliability, and cost limitations * Excellent critical thinking skills and problem-solving abilities * Excellent communication and interpersonal skills that enable you to work effectively with internal cross-functional teams and external partners * Multi-functional involvement on bundle format (Rhythm APD/Allegro), basic signal integrity/power integrity, warm, design rules, BOM, design for manufacturing, reliability, and cost * Ability to work independently and take on projects with minimal oversight * Ability to lead and manage teams * Knowledge of Cell bundling and systems an or more **Education and Experience** To be considered for this role, you'll need to have a Bachelor's degree and at least 10 years of significant industry experience. Your experience should include a strong background in semiconductor bundling configuration, cycle, and innovation advancement. **Compensation and Benefits** At arenaflex, we offer a comprehensive compensation and benefits package that includes: * Base salary: Our base salary is one part of our complete compensation package, not entirely settled within a range. This gives you the opportunity to advance as you grow and develop within a role. * Stock options: arenaflex employees have the opportunity to become shareholders through participation in our secondary employee stock option programs. * Benefits: arenaflex employees are eligible for extensive medical and dental coverage, retirement benefits, a range of discounted products and services, and reimbursement for specific educational costs related to advancing your career at arenaflex. * Additional rewards: This role may be eligible for secondary rewards or commission payments, as well as relocation assistance. **Why Join arenaflex?** At arenaflex, we're passionate about innovation, collaboration, and excellence. We're a company that thrives on creativity, and we're looking for talented individuals like you to join our journey. If you're passionate about details and driven by a desire for excellence, imagine what you could achieve here! **How to Apply** If you're a motivated and experienced IC Bundling Designing Lead looking for a new challenge, we encourage you to apply for this role. Please submit your resume and a cover letter outlining your experience and qualifications. **Note:** arenaflex advantage, pay, and employee stock programs are subject to qualification requirements and other terms of the relevant agreement or program. ```html Join arenaflex Today! Apply now to become a part of our dynamic team and start your journey with arenaflex! Apply Job! ``` Apply for this job